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|SanDisk Announces World’s First 256 Gigabit 3-bit-per-cell (X3) 48-layer 3D NAND Chip; Operations Begin for 3D NAND Pilot Line|
“We are pleased to announce our first 3D NAND chip targeted for
production,” said Dr. Siva Sivaram, executive vice president, memory
BiCS is a nonvolatile memory architecture designed to bring new levels of density, scalability and performance to flash-based devices. BiCS NAND memory will also provide enhanced write/erase endurance, write speeds and energy efficiency relative to conventional 2D NAND.
SanDisk’s 256 Gb X3 BiCS chip is designed for wide applicability in consumer, client, mobile and enterprise products, and is expected to begin shipping in SanDisk’s products in 2016.
This news release contains certain forward-looking statements, including
expectations for 3D NAND technology, including its development,
production timing, expected timing for shipment of